제품센터
Ag-F0801
Application
Apply to manufacturing the thick-film conductive pastes, such as the pastes for the internal and external electrodes of multi-layered component and circuit board (LTCC), PDP, HIC and solar cell.
Features
• Good dispersibility
• Low shrinkage
• High crystallinity
• Good electric conductivity
• Good filling property
Product specification
|
Specification |
Mean Particle Size(μm) |
Specific Surface Area(m2/g) |
Particle Size Distribution（μm） |
Tap Density(g/cm3) |
|||
|
D10 |
D50 |
D90 |
D99 |
||||
|
Ag-S0400 |
0.38-0.45 |
1.27-1.50 |
0.17-0.25 |
0.45-0.58 |
0.85-1.02 |
2.30-2.80 |
≥4.2 |
|
Ag-S0800 |
0.82-0.95 |
0.60-0.70 |
0.55-0.80 |
0.90-1.30 |
1.40-2.80 |
3.50-6.80 |
≥4.6 |
|
Ag-S2000 |
1.80-2.20 |
0.25-0.32 |
1.00-1.40 |
2.00-2.65 |
3.80-5.20 |
7.20-10.00 |
≥5.0 |
|
Ag-F0801 |
|
1.30-1.50 |
0.30-0.60 |
0.65-0.95 |
1.30-1.50 |
3.30-3.70 |
≥3.3 |
|
Ag-F2001 |
|
0.80-0.90 |
1.00-1.30 |
1.80-2.30 |
3.50-5.00 |
7.50-9.00 |
≥4.0 |
Different specificed products can be customized.
